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Routing in the Third Dimension : From VLSI Chips to MCMs |
| Naveed A. Sherwani (Intel Corporation); Siddharth Bhingarde; Anand Panyam |
| This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
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| Cloth Bound |
376 Pages,
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Item #:
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0780310896
$138.00 |
John Wiley & Sons, Inc. | |
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