Advanced Electronic Packaging, 2nd Edition |
| IEEE Press Series on Microelectronic Systems |
| Editor: Richard K. Ulrich (University of Arkansas); Editor: William D. Brown (University of Arkansas) |
| As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.
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| Cloth Bound |
812 Pages, 7 x 10 in.
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Item #:
Price: |
0471466093
$132.00 |
John Wiley & Sons, Inc. | |
