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Implementing Lead Free Solder in Electronics Manufacturing |
| Ron Gedney; Carol Handwerker (National Institute of Standards and Technology ); Richard Parker (Delphi Delco Electronic Systems ); Jasbir Bath (Solectron Corp. ); Edwin Bradley (Motorola, Inc. ) |
| Based on the results of a more than two-year study, Implementing Lead Free Solder in Electronics Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Implementing Lead Free Solder in Electronics Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timely–most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
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| Cloth Bound |
Pages, 6-1/8 x 9-1/4 in.
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Item #:
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0471448877
$99.95 |
John Wiley & Sons, Inc. | |
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