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Soldering Processes and Equipment |
| Editor: Michael G. Pecht (Univ. of Maryland, College Park) |
| Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.
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| Cloth Bound |
Pages, 6-1/8 x 9-1/4 in.
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Item #:
Price: |
047159167X
$160.00 |
John Wiley & Sons, Inc. | |
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